论坛时间：2016年5月27-28日

论坛地点：沪杏科技图书馆

主讲人：陈红宇

摘要：Polymer-based composites with high thermal conductivity (TC) are strongly desired to address the thermal dissipation challenge in the miniaturized/integrated electronics, 3-D chip stack architectures and LED devices. The high loading of thermally conductive fillers can definitely increase TC, but this usually results in poor processability, poor mechanical properties and high cost. Our modeling work has shown that the TC of polymer matrix has huge effect on the TC of final composites, especially when the filler loading is relatively low. In this talk, we will discuss our recent efforts on increasing the TC of polymers/polymer blends: (1) liquid crystalline (LC) epoxy; (2) polymer blends with hydrogen bonds.

主讲人简介：陈红宇，博士，陶氏化学fellow、陶氏亚太区首席研究员。2001年在美国凯斯西储大学高分子科学专业获得博士学位，在新泽西理工学院材料科学专业和华东理工大学高分子科学与工程专业获得硕士学位。拥有超过60项国际专利，并且在学术期刊上发表了60多篇文章。曾获得塑料工程师协会(SPE)颁发的最佳论文奖、上海市政府颁发的国际科学技术合作奖、陶氏亚太区创新奖和陶氏亚太区核心研发创新金奖等奖励。2013年当选为美国物理学会会士(APS Fellow)。